Hua Hong Group has consolidated its position in wafer fabrication and chip manufacturing through majority investments in Shanghai Hua Hong NEC Electronics Co., Ltd. and Shanghai Belling Co., Ltd., respectively. Hua Hong NEC, one of the world’s top 10 foundry service providers, owns the first 8-inch wafer fab in Mainland China, while Belling is the first Shanghai-listed IC manufacturer, making chips on 4-inch and 6-inch lines mainly for communications products.
Hua Hong Group owns 0.35um to 0.15um process technologies, logic and mixed signal technologies. It is capable of performing CMOS, BiCMOS, NVM (Non-Volatile Memory)、High Voltage, Radio Frequency, CMOS image sensor and other production processes in a complete range. The company and its affiliates also provide clients with a variety of design services, including the supply of IP cores, support in mainstream design flows, IC layout, and testing services. The IC chips, adopted by clients in various countries and regions such as China, South Korea, Japan, and the U.S., are selected for an extensive range of applications in communications, consumer electronics, and computing products. The chips include smart card ICs (such as chips for China’s second generation identification cards), LCD Drivers, DSC, PowerMOS, and other advanced memory ICs (DRAM, SDRAM, Flash).
Hua Hong Group’s subsidiaries of IC production have successfully achieved ISO 9001 certification for quality management, ISO14001 for environmental management, and BS7799-2 for information security management.
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